Photovoltaic diode module patents cover innovations in diode protection, packaging, and modeling for solar modules, enhancing reliability, thermal management, and electrical performance.

Key Patents and Innovations

1. Diode Module for Solar Protection (CN102683446A) This patent describes a diode module designed to protect solar photovoltaic cells. It features an aluminium substrate with insulating steel foils, with multiple diode chips arranged between the foils. The diode chips are covered with an epoxy plastic layer, and high-power diodes are directly sintered onto an AL PCB to improve heat dissipation, reduce packaging costs, and enhance reliability. The design emphasizes simple structure, convenient use, and improved thermal management . 2. Clip Bond Packaging Photovoltaic Diode Module (CN219180495) This utility model introduces a clip bond process for rapid packaging of diode modules. It includes a first and second frame, crystal grains, and conductors, with a plastic package body covering the assembly. The design allows high reliability, good electrical and thermal conductivity, and the inclusion of V-shaped grooves for water vapor discharge. This approach improves yield and applicability in photovoltaic systems . 3. Angle-Adjustable Diode Module (CN219145335) This patent focuses on a module with a diode body fixed on an aluminum substrate inside a main box. It features an angle-adjustable rotary joint for connecting photovoltaic equipment, allowing tight attachment to the back plate and improving mounting stability and ease of use. The design enhances linkage performance and operational convenience . 4. Single Diode Model Parameter Calculation (PCT/CN2024/124944) This patent covers a method and system for calculating parameters of a photovoltaic module using a single diode model. It allows modeling under various test conditions without a complete I-V curve, using performance parameters like short-circuit current, open-circuit voltage, and temperature coefficients. This innovation is significant for simulation, production, and optimization of photovoltaic modules .

Summary of Trends in Photovoltaic Diode Module Patents

• Thermal Management: Direct sintering of diodes on aluminum substrates and epoxy encapsulation improve heat dissipation.
• Packaging Efficiency: Clip bond and plastic encapsulation methods enable rapid assembly and high yield.
• Electrical Performance: Designs focus on reliable current conduction, voltage stability, and protection against overcurrent.
• Modeling and Simulation: Single diode models facilitate parameter identification and performance prediction without full I-V curves.
• Structural Flexibility: Angle-adjustable joints and modular frames enhance installation adaptability and mechanical stability. These patents collectively demonstrate a focus on enhancing reliability, thermal and electrical performance, and manufacturability of photovoltaic diode modules, reflecting ongoing innovation in solar energy protection and module optimization.